Along with the increasing miniaturization and multi-functionality of electronic products

the electromigration of micro-interconnections has become a severe and urgent issue

and turned to be an important reliability and durability concern.This paper presents a brief overview on the electromigrtion problem in aluminum and copper alloy interconnections

and then delivers a review on the electromigration issues in flip chip solder connection which is currently employed widely in mirco-electronic packaging technology.These issues include current crowding effect

joule heating effect

polarity effect

intermetallic compound

electromigration under multi-loads and lifetime of electromigration.