The influence of electromigration on creep fracture behavior of lead-free solder micro-interconnections was characterized under different current densities(0.8~1.27×10

4

A/cm

2

)and holding times(0~96 hours).The experiment results show that the creep damage process of the lead-free solder interconnected joints is obviously accelerated by electromigration effect

and the increases in both current density and holding time lead to an increase of creep strain rate and a decrease of creep lifetime of the joints.In addition

the electromigration effect leads to fracture mode transition phenomena at the cathode interface of the solder joints

that is

from ductile fracture in the joints without electromigration to brittle fracture for those after strong electromigration using high current density and long holding time.