The shortcomings of increasing weight

interconnecting lines and cost exist in traditional metal housing technique for hermetic packaging of microwave multichip modules(MMCMs).Low Temperature Co-fired Ceramics(LTCC)cavity technique is an excellent hermetic packaging solution to realize integration of microwave interconnecting substrate and packaging house for developing MMCMs.The microwave LTCC cavity structures and their transitions were simulated and optimized by the microwave analysis software in this paper.Good agreement was acquired between the simulated results and the experimental results.A X-band receive channel in transmit/receive(T/R) module was developed successful by LTCC cavity technique.