1. 北京有色金属研究总院!北京100088
2. 清华大学微电子学研究所!北京100084
纸质出版:1999
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[1]刘安生,邵贝羚,安生,刘峥,王敬,王瑞忠,钱佩信.层叠结构的Si_(0.65)Ge_(0.35)/Si红外探测器的微结构研究[J].电子学报,1999(11):13-15.
LIU An sheng 1, SHAO Bei ling 1, AN Sheng 1, et al. Study on Microstructure of Si0.65Ge0.35 /p Si Infrared Detector with a Stacked Structure[J]. Acta Electronica Sinica, 1999, (11).
采用定位的横断面透射电子显微术观察了P+Si065Ge035/pSi异质结内光发射红外探测器的微结构.该器件光敏区由6层p+Si065Ge035和5层UDSi层组成
每层都比较平整
各层厚度分别为6nm和32nm.在Si065Ge035/UDSi界面处存在应力场
但未观察到晶体缺陷.非晶SiO2台阶上的Si065Ge035和UDSi层是波浪状的多晶层.光敏区的边界处存在小于120nm宽的缺陷区
晶体缺陷的类型为层错和微孪晶
Microstructure of P + Si 0 65 Ge 0 35 /p Si heterojunction internal photoemission (HIP) infrared detector has been observed by using localization cross section transmission electron microscopy.The photo sensitive area in the detector consists of 6 P + Si 0 65 Ge 0 35 layers and 5 UD Si layers
which are smooth and have thickness of 6nm and 32nm
respectively.A stress field exists on the interface between Si 0 65 Ge 0 35 and UD Si layers
but the crystal defects have not been found in this area.Both Si 0 65 Ge 0 35 and UD Si layers on amorphous SiO 2 step consist of polycrystals and are in the shape of waves.There are defect regions in the edger of photo sensitive area.The region is less than 120nm in width.The crystal defects are stacking faults and microtwins.
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