A novel type of silicon condenser microphone with corrugated diaphragm has been proposed

designed

fabricated and tested.The e microphonecan be fabficated on a single wafer by use of silicon anisotropic etching and sacrificial layer etching techniques. The introduction of well performed corrugation has strongly increased the mechanicamesensitivity of the microphone diaphragm because of the reduction of the stthss in esin fnlms.Corrugations with different q values have been investigated

showing a close relationship between the ratio of the depth of the corrugation to the diaphragm thickness and mechanical sensitivity of the diaphragm. For the purpose of further decreasing thin film stress

composite siaphragm had been fabricated

reducing the initial stress to a much lower level of about 70MPa in tension. TTree etypes of corrugation placements in a diaphragm area of lmm by lmm have been fabricated. Microphones with higher than 10kHz bandwidth and sensitivity of 6. 8～16. 0mV/Pa under a relatively low bias voltage of about 5～15V have been fabricated. The experiments prove that the corrugation technique is promising for silicon condenser microphone.