1. 中国科学院等离子体物理研究所
2. 中国华晶电子集团公司
3. 中国科学院等离子体物理研究所中国华晶电子集团公司
纸质出版:1996
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[1]任兆杏,陈俊芳,丁振峰,史义才,宋银根,王道修.ECR-PECVD制备Si_3N_4薄膜的特性及其应用的研究[J].电子学报,1996(02):56-59.
任兆杏, 陈俊芳, 丁振峰, et al. Study on the Properties and Application of the Si3N4 Thin Film Prepared by ECR-PECVD[J]. Acta Electronica Sinica, 1996, (2).
本文利用ECR-PECVD技术在不同沉积温度下制备了Si3N4薄膜,利用Si3N4薄膜的透射光强度曲线计算了Si3N4薄膜的折射率和膜厚,计算结果与实测值符合较好。结果表明,随着沉积温度的提高,Si3N4薄膜的折射率增大,致密性提高,Si3N4薄膜厚度在60mm直径范围内不均匀度小于5%。测定了Si3N4薄膜的显微硬度。利用荧光分光光度计测定了Si3N4薄膜的光致发光效应。初步进行了Si3N4薄膜的超高频大功率晶体管器件中作为钝化膜的应用研究。
The Si3N4 thin films have been prepared by the ECR-PECVD technology under different deposition temperatures.The refractive index and thickness of the Si3N4 thin film have been calculated with the transmittance curve of the Si3N4 thin film
and the results agree with experimental measure.The results show that the density and refractive index increase with the increasing deposition temperature
the radial thickness nonuniformity of the Si3N4 thin film is about ±5% in the range of φ60mm.The microhardness has been measured.The photoluminescence effect of the Si3N4 thin film has been measured by the fluorescence spectrophotometer.The application of the passivation film of the superfrequency large power semiconducting transistor has been preliminarily investigated.
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