北京大学微电子学研究所
纸质出版:1994
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[1]王阳元,奚雪梅,甘学温,程玉华,李映雪.薄膜SOI/CMOS的SPICE电路模拟[J].电子学报,1994(05):88-93.
王阳元, 奚雪梅, 甘学温, et al. TFSOI/CMOS ICs Simulation Using SPICE[J]. Acta Electronica Sinica, 1994, (5).
鉴于SPICE是目前世界上广泛采用的通用电路模拟程序,且具有可扩展模型的灵活性,我们通过修改SPICE源程序把新器件模型──SOIMOSFET模型移植入SPICE中,通过我们的模拟工作,证实了我们模型的正确性和电路实用性,分析了器件参数对SOI/CMOS电路速度的影响,这些结论可以很好地指导电路设计和工艺实践.
A charge-based model for dc and transient circuit simulation has been implemented in SPICE
thereby enabling proper simulation and CAD of SOI/CMOS integrated circuits to be realized. The utility and computing efficiency of the SOIMOSFET model implementation are demonstrated by simulating several representative SOI/CMOS circuits. It has been shown that the shorter channel-length and the thinner Si-film thickness
the faster SOI/CMOS circuit speed
which can compensate low speed caused by decreased power voltage.
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