1. 南京大学物理系
2. 上海电子器材厂
纸质出版:1986
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[1]陈存礼,陈正夫,陈毅平,钟信群.高阻N型硅的欧姆接触[J].电子学报,1986(03):120-122.
Chen Cun-li. Ohmic Contact On High Resistivity N-Si[J]. Acta Electronica Sinica, 1986, (3): 120-122.
用银头烙铁直接把InAuSbNi合金(91:7:1:1)涂敷在硅片上
再经450℃的热处理
在高达600Ω·cm的N型硅上都得到了良好的欧姆接触。文中研究了它的接触性能;计算了金属对N型硅接触的接触电阻率和掺杂浓度的关系
并与实验作了比较。本方法已成功地用于杂质补偿度的测量。
Using an silver head electric soldering iron
the alloy consisting of In
Au
Sb and Ni in the ratio of 91: 7: 1:1 is directly smeared on the silicon wafer
which is then annealed at 450℃
Good quality ohmic contact is obtained even when the silicon resistivity is as high as 600Ωcm. The specific contact resistivity of metal to N-Si is calculated as a function of doping concentration and compared with experimental results. This contacting technigue is successfully applied to the measurement of impurity compensation.
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