北京真空电子器件研究所
纸质出版:1982
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[1]王基奎.螺旋线慢波结构的散热能力分析[J].电子学报,1982(06):25-32.
Wang Ji-Kui. An Analysis of the Capability of the Heat Dissipation of the Helical Slow Wave Structure[J]. Acta Electronica Sinica, 1982, (6): 25-32.
圆形介质杆弹性(或膨胀)夹持的螺旋线慢波结构的散热能力分析
目前还存在着计算接触面积与界面热阻的困难。本文试图解决这两个问题。文中建立了一个物理模型
推导了变形力与夹持过盈的关系式
使用弹性力学的分析结果求出了介质杆与螺旋线及管壳的接触面积。并引入了一个面积系数
解决了热阻计算的困难。文中还考虑了各种几何尺寸、材料物理性能
装配过盈及热膨胀修正等因素
编制了计算机程序进行了计算
结果与实验较为一致
从而得到了一些有设计参考价值的散热数据。
In analysing the capability of the heat dissipation of the helical slow wave structure elastically (or expansively) supported by round dielectric rods
two difficulties are encountered: one is how to calculate the contact area and the other is how to determine the interface thermal resistance. So far only very few papers have dealt with this subject.An attempt is made to solve these two difficulties in this paper. A model is constructed. The formula related to the distorted force with the interference is derived. The contact area between the rods and the helix (or the barrel) can be calculated using the analytic results of elastic mechanics. As a result of the analysis
it is believed that the interface thermal resis tance is actually caused by the reduction of the effective contact area due to a bad contact. Therefore it can be taken into consideration by introducing an area correction factor.Various factors
such as the geometric size
the physical properties of the materials
the interference and the expansive correction
are taken into account in the computer programming and a lot of calculations have been done.The theoretical calculation is in close agreement to the experimental results. Some useful data for the practical design of heat dissipation are obtained.
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