The yield of the Through-Silicon-Vias (TSVs)-based Three-Dimensional Integrated Circuits (3D ICs) is limited by the clustered faults due to immature manufacturing processes and aging. To tolerate TSV clustered faults

a redundancy architecture based on grouping at intervals is demonstrated in this paper. Owing to the use of grouping at intervals

the clustered TSV faults can be dispersed into different redundant groups and repaired with their own repair sources. Besides

MUX chains are utilized to realize the sharing of all repair sources. In experiments

compared with the previous router-based

ring-based and shift-switch redundancy architecture

the repair rates of proposed architecture are enhanced to 27.5%

62.7% and 11.4%

respectively. More importantly

the repair rate remains close to 100% in severely clustered situation.