面向系统集成的散热天线设计

周礼; 唐旻; 钱佳唯; 张跃平; 毛军发

doi:10.12263/DZXB.20211000

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面向系统集成的散热天线设计

综述评论 | 更新时间：2025-12-08

- 面向系统集成的散热天线设计
- Design of Heatsink Antennas for Integrated Systems
- 电子学报 2022年50卷第7期页码：1766-1773
- 作者机构：
  
  1.上海交通大学电子信息与电气工程学院电子工程系，上海 200240
  2.新加坡南洋理工大学电气与电子工程学院，新加坡 639798
- 作者简介：
  
  [ "周　礼　男，1992年出生，四川绵阳人.现为上海交通大学博士研究生.主要研究方向为封装天线和天线集成系统的协同设计.E-mail: zhouli0073@sjtu.edu.cn" ]
  [ "唐　旻（通讯作者）　男，1980年出生，江西南昌人.现为上海交通大学教授.主要研究方向为射频集成电路系统的建模仿真和协同设计.E-mail: tm222@sjtu.edu.cn" ]
- 基金信息：
  
  国家自然科学基金(61831016;62131014;61831006);上海市科学技术委员会项目(20501130400)
- DOI：10.12263/DZXB.20211000
  中图分类号： TN820.1;
- 收稿：2021-07-29，
  
  修回：2022-03-28，
  
  纸质出版：2022-07-25
- 稿件说明：
移动端阅览
周礼,唐旻,钱佳唯等.面向系统集成的散热天线设计[J].电子学报,2022,50(07):1766-1773.

ZHOU Li,TANG Min,QIAN Jia-wei,et al.Design of Heatsink Antennas for Integrated Systems[J].ACTA ELECTRONICA SINICA,2022,50(07):1766-1773.
周礼,唐旻,钱佳唯等.面向系统集成的散热天线设计[J].电子学报,2022,50(07):1766-1773. DOI： 10.12263/DZXB.20211000.

ZHOU Li,TANG Min,QIAN Jia-wei,et al.Design of Heatsink Antennas for Integrated Systems[J].ACTA ELECTRONICA SINICA,2022,50(07):1766-1773. DOI： 10.12263/DZXB.20211000.

摘要

散热天线是一种兼具电磁辐射特性和散热性能的新型结构，可以实现天线和散热器的功能一体化，提高系统的集成度.本文针对无线通信集成系统的散热天线发展历史和技术现状进行了综述，分别分析了散热单天线和毫米波散热天线阵列的典型结构以及电热协同设计方法的特点，最后对散热天线技术的发展方向进行了展望.本文认为多性能的协同设计理论以及与先进制冷方式的巧妙融合等，在5G无线通信领域将具有广泛的应用前景.

Abstract

The heatsink antenna is a novel structure with both electromagnetic radiation characteristics and heat dissipation performance

which can realize the functional integration of the antenna and the heat sink

thereby improving the degree of system-level integration. This article reviews the development history and technical status of heatsink antennas for wireless communication integrated systems

introduces the typical structures of heatsink single antennas and millimeter wave heatsink antenna arrays

as well as electro-thermal collaborative design methods

and looks forward to the development trend of heatsink antenna technique. The authors believe that multi-performance collaborative design theory and ingenious integration with advanced cooling methods

etc.

will have broad application prospects in the field of 5G wireless communication.

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Keywords

references

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