基于SOI-SOG键合的圆片级真空封装MEMS电场传感器
A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding
- 电子学报 2023年51卷第9期 页码：2517-2525
- 作者机构：
1.中国科学院空天信息创新研究院传感技术联合国家重点实验室,北京 100094
2.中国科学院大学电子电气与通信工程学院,北京 100049
3.中国科学院微电子研究所,北京 100029
- 作者简介：
[ "刘 俊 男，1995年8月出生于江西省南昌市. 现为中国科学院空天信息研究院传感技术国家重点实验室博士. 主要研究方向为微传感器封装技术. E-mail: liujun173@mails.ucas.ac.cn" ]
[ "夏善红（通讯作者） 女，1958年10月出生于北京市. 现为中国科学院空天信息研究院传感技术国家重点实验室教授、博士生导师. 在国内外发表学术论文300余篇." ]
- 基金信息：国家自然科学基金(62031025)
DOI：10.12263/DZXB.20211364
中图分类号： TP212;收稿：2021-10-09，
修回：2022-03-30，
纸质出版：2023-09-25
- 稿件说明：
移动端阅览
刘俊,夏善红,彭春荣等.基于SOI-SOG键合的圆片级真空封装MEMS电场传感器[J].电子学报,2023,51(09):2517-2525.
LIU Jun,XIA Shan-hong,PENG Chun-rong,et al.A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding[J].ACTA ELECTRONICA SINICA,2023,51(09):2517-2525.
刘俊,夏善红,彭春荣等.基于SOI-SOG键合的圆片级真空封装MEMS电场传感器[J].电子学报,2023,51(09):2517-2525. DOI： 10.12263/DZXB.20211364.
LIU Jun,XIA Shan-hong,PENG Chun-rong,et al.A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding[J].ACTA ELECTRONICA SINICA,2023,51(09):2517-2525. DOI： 10.12263/DZXB.20211364.
摘要
圆片级真空封装是提高微电子机械系统（Micro-Electro-Mechanical Systems，MEMS）电场传感器品质因数及批量化制造效率的重要途径. 本文提出了一种基于绝缘体上硅（Silicon On Insulator， SOI）-玻璃体上硅（Silicon On Glass，SOG）键合的圆片级真空封装MEMS电场传感器，设计并实现了从传感器敏感结构制备到真空封装的整套圆片级加工工艺. 本文建立了传感器的结构电容模型，进行了有限元仿真，分析了传感器的特性，突破了传感器微结构制备与释放、SOI与SOG键合等工艺技术难点. 该传感器具有工作电压低、品质因数高的突出优点. 实验结果表明，工作电压仅为5 V直流与0.05 V交流电压. 在60天测试过程中，传感器品质因数始终保持在5 000以上. 在0~50 kV/m范围内，传感器灵敏度为0.15 mV/（kV/m），线性度为2.21%，不确定度为4.74%.
Abstract
Wafer-level vacuum packaging is an important way to improve the quality factor of the MEMS (Micro-Electro-Mechanical Systems) electric field sensor and the efficiency of batch manufacture. This paper proposes a novel wafer-level vacuum packaged electric field sensor based on SOI-SOG (Silicon on Insulator-Glass on Silicon) bonding. A wafer-level manufacture process
including the fabrication of sensitive structure and the vacuum package of the sensor
is designed and realized. This paper set up a structural capacitance model of the sensor
carried out the finite element simulation
analyzed the characteristics of the sensor
and broke through the technical difficulties in the microfabrication process
such as the fabrication and release of the microstructure
and the bonding of the SOI and the SOG. The sensor has the advantages of low working voltage and high quality factor. Experimental results reveal that driving signals with 5 V DC voltage and 0.05 V AC voltage are required for the sensor. The quality factor is higher than 5 000
which is kept with no drop in 60-days test. The sensitivity of the sensor is 0.15 mV/(kV/m)
the linearity is 2.21% and the accuracy is 4.74% in the range of 0~50 kV/m.
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references
MONTANYA J , BERGAS J , HERMOSO B . Electric field measurements at ground level as a basis for lightning hazard warning [J]. Journal of Electrostatics , 2004 , 60 ( 2-4 ): 241 - 246 .
李仙丽 , 王冬冬 , 李向龙 , 等 . 基于电光聚合物缺陷光子晶体的脉冲电场测量技术 [J]. 电子学报 , 2021 , 49 ( 9 ): 1691 - 1700 .
LI X L , WANG D D , LI X L , et al . Photonic crystal with electro-optic polymer defect for a pulse electric field sensor [J]. Acta Electronica Sinica , 2021 , 49 ( 9 ): 1691 - 1700 . (in Chinese)
BARTHOD C , PASSARD M , BOUILLOT J , et al . High electric field measurement and ice detection using a safe probe near power installations [J]. Sensors and Actuators A: Physical , 2004 , 113 ( 2 ): 140 - 146 .
贾亦卓 , 姜润翔 , 龚沈光 . 基于小波模极大值能量的船舶轴频电场检测 [J]. 电子学报 , 2014 , 42 ( 3 ): 592 - 596 .
JIA Y Z , JIANG R X , GONG S G . Detection of ship shaft-rate electric field signal based on wavelet modulus maximum power [J]. Acta Electronica Sinica , 2014 , 42 ( 3 ): 592 - 596 . (in Chinese)
ZENG Q F , WANG Z H , GUO F X , et al . The application of lightning forecasting based on surface electrostatic field observations and radar data [J]. Journal of Electrostatics , 2013 , 71 ( 1 ): 6 - 13 .
张华 , 王向军 , 单潮龙 , 等 . 基于目标静电场的水中兵器制导方法研究 [J]. 电子学报 , 2013 , 41 ( 3 ): 470 - 474 .
ZHANG H , WANG X J , SHAN C L , et al . Research of guidance method based on the electrostatic field of target for underwater weapon [J]. Acta Electronica Sinica , 2013 , 41 ( 3 ): 470 - 474 . (in Chinese)
LEI H C , XIA S H , CHU Z Z , et al . An electric field microsensor with mutual shielding electrodes [J]. Micromachines , 2021 , 12 ( 4 ): 360 .
TANG L J , ZHOU N R , et al . Design of DC electroscope system based on MEMS electric field sensor [J]. Transducer and Microsystem Technologies , 2019 , 38 ( 9 ): 77 - 80 .
YANG P F , PENG C R , FANG D M , et al . Design, fabrication and application of an SOI-based resonant electric field microsensor with coplanar comb-shaped electrodes [J]. Journal of Micromechanics and Microengineering , 2013 , 23 ( 5 ): 055002 .
凌必赟 , 彭春荣 , 任仁 , 等 . 低轴间耦合的MEMS三维电场传感器 [J]. 电子与信息学报 , 2018 , 40 ( 8 ): 1934 - 1940 .
LING B Y , PENG C R , REN R , et al . MEMS-based three-dimensional electric field sensor with low cross-axis coupling interference [J]. Journal of Electronics & Information Technology , 2018 , 40 ( 8 ): 1934 - 1940 . (in Chinese)
KOBAYASHI T , OYAMA S , TAKAHASHI M , et al . Microelectromechanical systems-based electrostatic field sensor using Pb(Zr, Ti)O 3 Thin films [J]. Japanese Journal of Applied Physics , 2008 , 47 ( 9 ): 7533 - 7536 .
ZHANG H Y , FANG D M , YANG P F , et al . Humidity-induced charge leakage and field attenuation in electric field microsensors [J]. Sensors , 2012 , 12 ( 4 ): 5105 - 5115 .
WEN X L , PENG C R , FANG D M , et al . High performance electric field micro sensor with combined differential structure [J]. Journal of Electronics (China) , 2014 , 31 ( 2 ): 143 - 150 .
WEN X L , YANG P F , ZHANG Z W , et al . Resolution enhancing structure for the electric field microsensor chip [J]. Micromachines , 2021 , 12 ( 8 ): 936 - 950 .
WEN X L , YANG P F , CHU Z Z , et al . Toward atmospheric electricity research: A low-cost, highly sensitive and robust balloon-borne electric field sounding sensor [J]. IEEE Sensors Journal , 2021 , 21 ( 12 ): 13405 - 13416 .
王阳元 , 武国英 , 郝一龙 , 等 . 硅基MEMS加工技术及其标准工艺研究 [J]. 电子学报 , 2002 , 30 ( 11 ): 1577 - 1584 .
WANG Y Y , WU G Y , HAO Y L , et al . Study of silicon-based MEMS technology and its standard process [J]. Acta Electronica Sinica , 2002 , 30 ( 11 ): 1577 - 1584 . (in Chinese)
董林玺 , 颜海霞 , 钱忺 , 等 . 倾斜梳齿的MEMS电容式传感器惯性脉冲响应特性研究 [J]. 电子学报 , 2008 , 36 ( 5 ): 1035 - 1040 .
DONG L X , YAN H X , QIAN X , et al . Study of inertial pulse response of MEMS capacitive accelerometer with non-parallel combs [J]. Acta Electronica Sinica , 2008 , 36 ( 5 ): 1035 - 1040 . (in Chinese)
董林玺 , 焦继伟 , 颜海霞 , 等 . 新型磁驱动增大检测电容的高精度MEMS惯性传感器研究 [J]. 电子学报 , 2010 , 38 ( 5 ): 1053 - 1057 .
DONG L X , JIAO J W , YAN H X , et al . A novel MEMS inertial sensor with the actuators drived by Lorentz force for increasing the initial sensing capacitance [J]. Acta Electronica Sinica , 2010 , 38 ( 5 ): 1053 - 1057 . (in Chinese)
XIE B , XING Y H , WANG Y S , et al . Vacuum-packaged resonant pressure sensor with dual resonators for high sensitivity and linearity [J]. Procedia Engineering , 2015 , 120 : 194 - 199 .
MAHMOOD M S , ÇELIK-BUTLER Z . Wafer-level vacuum-packaged flexible and bendable micro accelerometer [J]. IEEE Sensors Journal , 2018 , 18 ( 10 ): 4089 - 4096 .
LI Y D , CHENG C , LU Y L , et al . A high-sensitivity resonant differential pressure microsensor based on bulk micromachining [J]. IEEE Sensors Journal , 2021 , 21 ( 7 ): 8927 - 8934 .
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