太赫兹功率放大单片封装技术研究

张博; 张勇; 江伟佳; 刘广儒; 徐锐敏; 延波

doi:10.12263/DZXB.20221317

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太赫兹功率放大单片封装技术研究

太赫兹超表面技术及应用 | 更新时间：2025-12-08

- 太赫兹功率放大单片封装技术研究
- Research on Terahertz Monolithic Integrated Power Amplifier Package
- 电子学报 2023年51卷第10期页码：2724-2732
- 作者机构：
  
  电子科技大学电子科学与工程学院，四川成都 611731
- 作者简介：
  
  [ "张博男，1995年出生于河北省衡水市.2019年毕业于电子科技大学电磁场与无线技术专业，获学士学位.现为电子科技大学博士研究生，主修电子科学与技术.主要研究方向为微波/毫米波电路理论与技术，以及毫米波和太赫兹固态电路与系统.E-mail: 2834874954@qq.com" ]
  [ "张勇（通讯作者）男，1975年9月出生于四川省南充市.电子科技大学教授，博士生导师，IEEE高级会员.2004年获电子科技大学博士学位.四川省海外高层次留学人才，入选第十二批电子科技大学“百人计划”，入选第七批国家高层次人才.主要研究方向为微波与毫米波集成电路，以及固态太赫兹技术等.中国电子学会会员编号：E190029499M." ]
  [ "江伟佳男，1998年4月出生于安徽省滁州市.2020级电子科技大学硕士研究生.主要研究方向为包括毫米波/太赫兹集成电路和系统.E-mail: 1349257166@qq.com" ]
  [ "刘广儒男，2000年2月出生于山西省晋中市.现为电子科技大学硕士研究生.主要研究方向为包括毫米波/太赫兹集成电路和系统.E-mail: guangru.liu@qq.com" ]
- 基金信息：
  
  微波毫米波单片集成和模块电路重点实验室开放基金项目(61428032204)
- DOI：10.12263/DZXB.20221317
  中图分类号： TN454;
- 收稿：2022-11-16，
  
  修回：2023-09-11，
  
  纸质出版：2023-10-25
- 稿件说明：
移动端阅览
张博,张勇,江伟佳等.太赫兹功率放大单片封装技术研究[J].电子学报,2023,51(10):2724-2732.

ZHANG Bo,ZHANG Yong,JIANG Wei-jia,et al.Research on Terahertz Monolithic Integrated Power Amplifier Package[J].ACTA ELECTRONICA SINICA,2023,51(10):2724-2732.
张博,张勇,江伟佳等.太赫兹功率放大单片封装技术研究[J].电子学报,2023,51(10):2724-2732. DOI： 10.12263/DZXB.20221317.

ZHANG Bo,ZHANG Yong,JIANG Wei-jia,et al.Research on Terahertz Monolithic Integrated Power Amplifier Package[J].ACTA ELECTRONICA SINICA,2023,51(10):2724-2732. DOI： 10.12263/DZXB.20221317.

摘要

本文对太赫兹功率放大单片封装技术进行研究，主要包括波导-微带垂直过渡和模块内的模式谐振抑制技术.不同于常规的矩形探针平面过渡，本文提出了一种基于分叉探针的垂直过渡结构，适用于多层电路排布的系统/模块封装，并在WR-4波导频段（170~260 GHz）进行了背靠背结构的实验验证，在整个波导频带内，回波损耗优于16 dB，单个过渡的插入损耗约0.42 dB，这包括了波导模块接触不良造成的额外的损耗.为进一步降低过渡损耗，提出了一种开口谐振环结构，用来抑制不良接触导致的电磁泄漏，使过渡损耗降低为原来的一半.此外，为避免功率放大模块内部发生模式谐振，提出将电磁带隙结构设置在平面传输线的上腔来抑制高次模的激励、传输和谐振.应用上述技术对工作于210~230 GHz的功率放大单片进行封装及测试.在210 GHz，小信号增益达到最大值20.75 dB，单端封装损耗约0.8 dB；在217 GHz达到最大输出功率15.6 dBm，与芯片手册数据吻合较好.

Abstract

In this paper

the packaging technique of terahertz monolithic integrated power amplifier is studied

i.e. waveguide-to-microstrip vertical transition and mode-resonance suppression techniques. Different from the conventional horizontal transition based on rectangular probes

a vertical transition based on a bifurcated probe is proposed

which is suitable for multilayer circuits. To verify the performance

a back-to-back transition is fabricated and measured. In the range of 170~260 GHz

the measured return loss is better than 16 dB

while the single insertion loss

including the loss caused by non-ideal metallic contact

is around 0.42 dB. To further reduce the transition loss

a resonance ring with a slot is proposed to avoid the electromagnetic leakage. As a result

the simulated insertion loss is reduced by half. Moreover

the issue of mode resonance in the amplifier cavity is studied

and electromagnetic band gap structures are set above the plane transmission line to suppress the excitation

transmission and resonance of higher modes. The above techniques are applied to a power amplifier which is operated at 210~230 GHz. In the measurement

the maximum small-signal gain of 20.75 dB and the single packaging loss of 0.8 dB are observed at 210 GHz. At 217 GHz

the maximum output power of higher than 15.6 dBm is achieved

which is consistent with the manual.

关键词

Keywords

references

刘松卓 , 于伟华 , 邓长江 , 等 . 面向通信系统的太赫兹调制技术进展现状 [J]. 无线电通信技术 , 2021 , 47 ( 1 ): 44 - 50 .

LIU S Z , YU W H , DENG C J , et al . Recent progress of research on terahertz signal modulation technology for communication systems [J]. Radio Communications Technology , 2021 , 47 ( 1 ): 44 - 50 . (in Chinese)

HASSANIN A A I M , SHAABAN A S E , ABD . EL-SAMIE Medical applications of image reconstruction using electromagnetic field in terahertz frequency range [C]// 2019 International Symposium on Networks, Computers and Communications (ISNCC) . Piscataway : IEEE , 2019 : 1 - 4 .

张开春 . 太赫兹扩展互作用振荡器的矩形耦合腔特性研究 [J]. 电子学报 , 2011 , 39 ( 3 ): 632 - 635 .

ZHANG K C . Study of characteristic of rectangular coupled-cavity slow-wave structure for extended interaction oscillator in terahertz band [J]. Acta Electronica Sinica , 2011 , 39 ( 3 ): 632 - 635 . (in Chinese)

吴振华 , 张开春 , 刘盛纲 . 折叠波导结构的THz振荡辐射源研究 [J]. 电子学报 , 2009 , 37 ( 12 ): 2677 - 2680 .

WU Z H , ZHANG K C , LIU S G . Research of THz folded waveguide oscillator radiation source [J]. Acta Electronica Sinica , 2009 , 37 ( 12 ): 2677 - 2680 . (in Chinese)

LI X C , CHEN W H , WANG Y F , et al . A 160 GHz high output power and high efficiency power amplifier in a 130-nm SiGe BiCMOS technology [C]// 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) . Piscataway : IEEE , 2020 : 199 - 202 .

CHEN Y , ZHANG L , WANG Y , et al . A 143GHz power amplifier based on over neutralization and power combining technique in 65nm CMOS [C]// 2017 International Conference on Electron Devices and Solid-State Circuits (EDSSC) . Piscataway : IEEE , 2017 : 1 - 2 .

SHIH Y C , TON T N , BUI L Q . Waveguide-to-microstrip transitions for millimeter-wave applications [C]// 1988., IEEE MTT-S International Microwave Symposium Digest . Piscataway : IEEE , 2002 : 473 - 475 .

LEONG Y C , WEINREB S . Full band waveguide-to-microstrip probe transitions [C]// 1999 IEEEMTT-S International Microwave Symposium Digest . Piscataway : IEEE , 2002 : 1435 - 1438 .

LEONG K M K H , DEAL W R , RADISIC V , et al . A 340-380 GHz integrated CB-CPW-to-waveguide transition for sub millimeter-wave MMIC packaging [J]. IEEE Microwave and Wireless Components Letters , 2009 , 19 ( 6 ): 413 - 415 .

ZHU H L , ZHANG Y , WU C K , et al . Integrated dipole antenna with bandwidth enhancement for terahertz waveguide-to-CPWG transition [J]. IEEE Antennas and Wireless Propagation Letters , 2020 , 19 ( 12 ): 2433 - 2436 .

GRABHERR W , HUDER W G B , MENZEL W . Microstrip to waveguide transition compatible with MM-wave integrated circuits [J]. IEEE Transactions on Microwave Theory and Techniques , 1994 , 42 ( 9 ): 1842 - 1843 .

KHANI B , MAKHLOUF S , DIILME S , et al . InP-based grounded coplanar waveguide to WR3 transition for monolithic integration with THz photodiodes [C]// 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) . Piscataway : IEEE , 2018 : 1 - 2 .

KANEDA N , QIAN Y , ITOH T . A broad-band microstrip-to-waveguide transition using quasi-Yagi antenna [J]. IEEE Transactions on Microwave Theory and Techniques , 1999 , 47 ( 12 ): 2562 - 2567 .

KIM J , CHOE W , JEONG J . Submillimeter-wave waveguide-to-microstrip transitions for wide circuits/wafers [J]. IEEE Transactions on Terahertz Science and Technology , 2017 , 7 ( 4 ): 440 - 445 .

ZHANG B , ZHANG Y , WU C K , et al . Millimeter-wave broadband waveguide-to- microstrip transition using a bifurcated probe [J]. IEEE Microwave and Wireless Components Letters , 2022 , 32 ( 9 ): 1031 - 1034 .

RAJO-IGLESIAS E , ZAMAN A U , KILDAL P-S . Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails [J]. IEEE Microwave and Wireless Components Letters , 2010 , 20 ( 1 ): 31 - 33 .

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