The areas at an altitude of 1000m and above account for 65% of the total area of China

therefore

China is a plateau country.For electronic devices such as computers

cooling ability is much affected by attitude

and electric heat dissipation directly affects the service life of components

computing speed

stability

etc.To study the effects of altitude on the cooling of electric devices

the altitude parameters are introduced to modify the Zukauskas mathematical model

Chiltion-Colburn model

and other heat transfer models

according to the fundamental theory of thermodynamics.Electrical heat calculation method for the electronic devices at different altitudes is proposed

and the relationship between the altitude and electrical cooling capability is revealed.The analysis result conforms to the international electro-technical commission standard experiment and is verified by the specialized thermal design software Ansys.Icepak4.5

which provides theoretical basis for the thermal design and the life-span evaluation of the electric devices

such as computers

at different altitudes.