This paper describes fundamentals of die-level assembly techniques for phase-only liquid crystal on silicon(LCOS) devices

which have not been in-depth discussed previously.The discussion contains the introduction to the basic assembly process

analysis to key assembly procedures

inspection to the assembled device and overall quality control including pre-assembly inspection and cleaning process for both glass and silicon backplane

alignment layer deposition with baking process

glue line processing

assembly and liquid crystal filling process.In particular

glue line writing

liquid crystal filling and overall quality assessment of assembly process have been substantially investigated.Finally

the excellent quality of assembled phase-only LCOS devices with characteristics have been defined.