黄宇, 刘斯扬, 顾春德, 等. 1.2kV SiC MOSFET器件URS应力退化机理研究[J]. 电子学报, 2016,44(1):130-134.
HUANG Yu, LIU Si-yang, GU Chun-de, et al. The Degradation Mechanism for 1.2kV SiC MOSFET Under Unclamped Repetitive Stress[J]. Acta Electronica Sinica, 2016, 44(1): 130-134.
HUANG Yu, LIU Si-yang, GU Chun-de, et al. The Degradation Mechanism for 1.2kV SiC MOSFET Under Unclamped Repetitive Stress[J]. Acta Electronica Sinica, 2016, 44(1): 130-134. DOI: 10.3969/j.issn.0372-2112.2016.01.019.
The degradation behavior for 1.2kV Silicon Carbide (SiC) MOSFET under unclamped repetitive stress (URS) has been firstly investigated in detail by the analysis of two-dimensional device simulations and charge pumping measurements.It has been shown that
when the device is under URS condition
the electric field and impact ionization in the accumulation region become sufficiently large
so as to generate numerous hot holes.These avalanched-generated hot holes will be injected and trapped into the gate oxide above the accumulation region
resulting in an initial decrease of the on-state resistance and threshold voltage
as well as an increase in drain-source leakage current.