3D NoC stacking the multi-chips with TSV has many advantages

such as high integration density and high communication efficiency.It is the mainstream of communication architecture on multi-core on-chip systems.However

due to the process variation

physical defects and low yield of TSV

3D NoC is facing serious fault problems.It is essential to design a fault-tolerant mechanism for 3D NoC to ensure the efficiency of communication.In this paper

we focus on the failure and fault-tolerance issues of the critical communication components (routers and TSVs) in 3D NoC.From the description of fault-tolerance necessity

researches situation at home and abroad

future research directions

key issues and the proposed solutions

we conduct an in-depth discussion.Thus

we provide integrated solutions for improving the reliability of NoC and ensuring efficient communication system.