ZHOU Yi-lin, ZHU Meng, HUO Yu-jia. The Influence of the Dielectric Properties of Dust Particles on Electrochemical Migration of Printed Circuit Board[J]. Acta Electronica Sinica, 2017, 45(7): 1758-1763.
ZHOU Yi-lin, ZHU Meng, HUO Yu-jia. The Influence of the Dielectric Properties of Dust Particles on Electrochemical Migration of Printed Circuit Board[J]. Acta Electronica Sinica, 2017, 45(7): 1758-1763. DOI: 10.3969/j.issn.0372-2112.2017.07.028.
The distance between adjacent circuits of high density printed circuit board (PCB) is reduced gradually.The particles of different components have different permittivity
which changes the electric field distribution that induces electrochemical migration (ECM) failure.In this paper
by the finite element method
the electric field distribution between the paralleled circuits with potential bias on PCB contaminated by dust is analyzed.The mechanism of the dielectric constant and the amount of charges of dust particles on the electric field distribution is studied.The effect of electric field distribution on dendrite growth path is predicted.Finally
by the electrochemical migration simulation experiments
the relation between the electric field distribution and dendrite growth path is verified.The time to failure of ECM caused by the change of electric field is also discussed.