Memory dies stacking strategy and redundancy sharing structure have great effects on the yield of three-dimensional (3D) memory. To improve 3D memory yield and reduce the number of TSVs consumed by row and column redundancies

this paper proposed a redundancy sharing structure among adjacent layers. In the proposed sharing structure

the redundancies in each layer not only can be used to repair the faults in the layer where the redundancies reside

but also can be utilized by adjacent layers. On the basis of this proposed structure

a new die-stacking strategy is presented. Through formularized selection conditions for memory dies

the presented strategy can choose suitable memory dies to stack 3D memory. In this way

the row and column redundancies are fully used. Experimental results illustrate the proposed redundancy sharing structure and die-stacking strategy can effectively improve 3D memory yield and reduce the number of TSVs consumed by spare rows and columns.