In order to improve the heat dissipation capacity of chip with high heat flux density

this paper presents some bionic micro channel topologic structures which are designed based on natureral network topologies with excellent heat and mass transfer characteristic.Then the heat dissipation and pressure drop of different topologies are analyzed by numerical simulation.The calculation results indicate that there exists differences in the heat dissipation capacity of different topologies.With the increasing of heat flux density

the differences become more obvious.The heat dissipation characteristics of the spider web structure with excellent performance are analyzed theoretically.The micro-channel heat sink is fabricated by 3D printing.The testing results indicate that the heat dissipation capacity of the spider web structure has a better performance than current existing flat micro-channel.