The interconnection structure is a key part between the electrical device and the printed circuit board as the mechanical fixing and electrical interconnection.Aiming at the difficulties in real-time monitoring and extracting characterization signals for the health status of interconnects

firstly

a degenerate electrical model was established in this paper

by analyzing the failure modes and mechanisms of the QFP interconnect structure.Then

according to the degraded electrical model of the interconnect structure

a real-time monitoring circuit was built

with the charging time of the external capacitor selected as the characterization signal

and the relationship between the electrical parameters of the degradation model and the charging time was established.Afterwards

the Multisim and the development board had been used to simulate and verify the relationship between the equivalent electrical model parameters and the charging time in the degradation process of the interconnect structure.Finally

in order to analyze the degradation process of interconnects

a small system test board was used for random vibration test.From the results

combined with the electron microscope image of the interconnect structure

it was found that the charge time can characterize the failure process and failure mode of the interconnect structure well.