电子学报 ›› 2021, Vol. 49 ›› Issue (4): 805-811.DOI: 10.12263/DZXB.20190957

所属专题: 硅基半导体器件新进展

• 科研通信 • 上一篇    下一篇

基于间隔分组的TSV聚簇故障冗余结构

左小寒1, 梁华国1, 倪天明2, 杨兆1, 束月1, 蒋翠云3, 鲁迎春1   

  1. 1. 合肥工业大学电子科学与应用物理学院, 安徽合肥 230009;
    2. 安徽工程大学电气工程学院, 安徽芜湖 241000;
    3. 合肥工业大学数学学院, 安徽合肥 230009
  • 收稿日期:2019-08-21 修回日期:2020-07-10 出版日期:2021-04-25 发布日期:2021-04-25
  • 通讯作者: 鲁迎春
  • 作者简介:左小寒 女,1995年3月出生,安徽铜陵人.硕士研究生,主要研究方向:三维集成电路的测试与容错.E-mail:861819322@qq.com;梁华国 男,1959年7月出生,安徽合肥人.教授,博士生导师,CCF高级会员,主要研究方向:嵌入式系统综合与测试、数字系统设计自动化、高可靠性的工业控制计算机研究等.E-mail:huagulg@hfut.edu.cn
  • 基金资助:
    国家自然科学基金(No.61674048,No.61834006)

A TSV Redundancy Architecture for Clustered Faults Based on Interval Grouping

ZUO Xiao-han1, LIANG Hua-guo1, NI Tian-ming2, YANG Zhao1, SHU Yue1, JIANG Cui-yun3, LU Ying-chun1   

  1. 1. School of Electronic Science&Applied Physics, Hefei University of Technology, Hefei, Anhui 230009, China;
    2. College of Electrical Engineering, Anhui Polytechnic University, Wuhu, Anhui 241000, China;
    3. School of Mathematics, Hefei University of Technology, Hefei, Anhui 230009, China
  • Received:2019-08-21 Revised:2020-07-10 Online:2021-04-25 Published:2021-04-25

摘要: 由于不成熟的工艺技术和老化影响,基于硅通孔(Through Silicon Via,TSV)的三维集成电路(Three-Dimensional Integrated Circuit,3D IC)中易发生聚簇故障,而降低芯片良率.为修复TSV聚簇故障,本文提出基于间隔分组的故障冗余结构.通过间隔分组将聚簇的TSV故障分散到不同冗余组从而利用各组的冗余资源修复,并利用MUX链实现组间共享冗余资源.实验结果表明,相较传统的路由、环形、切换转移冗余结构,本文结构修复率分别提高27.5%、62.7%及11.4%.并且在聚簇严重的情况下,本文结构修复率保持接近100%.

关键词: 三维集成电路, 硅通孔, 聚簇故障, 间隔分组, 冗余修复

Abstract: The yield of the Through-Silicon-Vias (TSVs)-based Three-Dimensional Integrated Circuits (3D ICs) is limited by the clustered faults due to immature manufacturing processes and aging.To tolerate TSV clustered faults,a redundancy architecture based on grouping at intervals is demonstrated in this paper.Owing to the use of grouping at intervals,the clustered TSV faults can be dispersed into different redundant groups and repaired with their own repair sources.Besides,MUX chains are utilized to realize the sharing of all repair sources.In experiments,compared with the previous router-based,ring-based and shift-switch redundancy architecture,the repair rates of proposed architecture are enhanced to 27.5%,62.7% and 11.4%,respectively.More importantly,the repair rate remains close to 100% in severely clustered situation.

Key words: 3D IC, TSV, clustered faults, interval grouping, redundancy and repair

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