Virtex-5系列芯片没有官方提供的专用软错误缓解（Soft Error Mitigation，SEM）IP核，需自行设计故障注入系统.本文选用XC5VFX130T型现场可编程门阵列（Field Programmable Gate Array，FPGA）芯片利用单帧部分重构功能达到等同于SEM IP故障注入效果，实现对FPGA电路系统的抗单粒子翻转能力评估测试.利用逐位注入故障模式对XC5VFX130T型FPGA的配置位逐个注入故障，获得待评估电路的敏感配置位信息；对待测电路进行三模冗余防护加固，利用累积故障注入模式连续随机注入模拟单粒子辐照试验环境，得到待评估电路的功能中断截面，进而实现对基于XC5VFX130T型FPGA系统的抗单粒子翻转加固效果的评估.研究表明，基准电路（移位寄存器链等）评估得到的功能中断截面与实际辐照试验中的功能中断截面曲线变化一致，为机载电子的单粒子效应适航评估提供了支持.

The Virtex-5 series chips do not have an official soft error mitigation(SEM) IP core, so they need to design their own fault injection system.The XC5VFX130T field programmable gate array(FPGA) chip is selected to achieve the effect equivalent to SEM IP fault injection with the single-frame partial reconstruction function, and the single-event upset resistance of FPGA circuit system is evaluated and tested.The configuration bits of XC5VFX130T FPGA are injected one by one in bitwise injection fault mode to obtain the sensitive configuration bit information of the circuit to be evaluated.The test circuit was reinforced with three-mode redundancy protection, and the cumulative fault injection mode was used to simulate the single-particle irradiation test environment. The functional interruption section of the circuit to be evaluated was obtained, and then the anti-single-event upset reinforcement effect of XC5VFX130T FPGA system was evaluated.The study shows that the function interruption cross section of reference circuit such as shift register chain is consistent with the change of function interruption cross section curve of actual irradiation test, which provides support for the airworthiness evaluation of airborne electron with single event effect.