磁头无铅微焊点液滴飞溅和失效性分析

doi:10.3969/j.issn.0372-2112.2015.04.020

电子学报 ›› 2015, Vol. 43 ›› Issue (4): 769-775.DOI: 10.3969/j.issn.0372-2112.2015.04.020

磁头无铅微焊点液滴飞溅和失效性分析

肖祥慧¹, 彭敏放¹, 贺建飚², 唐荣军³, 周影良³

1. 湖南大学电气与信息工程学院, 湖南长沙 410082;
2. 中南大学信息科学与工程学院, 湖南长沙 410083;
3. 日本TDK集团, 广东东莞 523000

收稿日期:2014-05-21 修回日期:2014-06-30 出版日期:2015-04-25 发布日期:2015-04-25
作者简介:肖祥慧 男,1983年9月出生,湖南邵阳人.湖南大学电气与信息工程学院电气工程专业博士研究生、讲师.主要从事接地网故障诊断,智能电网、电磁场理论及其应用,智能信息处理等方面的研究工作.E-mail:xiaoen3@126.com;彭敏放 女,1964年3月生,湖南湘乡人,1991年、2006年分别在湖南大学获得工学硕士和工学博士学位,现为湖南大学电气与信息工程学院教授、博士生导师,湖南省新世纪121人才工程人选,主要从事电路测试与诊断、智能信息处理、电力系统故障分析及其设备状态监测、电磁场理论及其应用等方面的研究工作.E-mail:pengminfang@hnu.edu.cn
基金资助:
国家自然科学基金(No.61173108,No.60973032,No.60673084,No.61272147);湖南省自然科学基金(No.10JJ2045);湖南省学位与研究生教育教改(No.JG2011C004)

The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

XIAO Xiang-hui¹, PENG Min-fang¹, HE Jian-biao², TANG Rong-jun³, ZHOU Ying-liang³

1. Institute of Electrical and Information Engineering, Hunan University, Changsha, Hunan 410082, China;
2. School of Information Science and Engineering, Central South University, Changsha, Hunan 410083, China;
3. Japan's TDK Groups, Dongguan, Guangdong 523000, China

Received:2014-05-21 Revised:2014-06-30 Online:2015-04-25 Published:2015-04-25

摘要/Abstract

摘要：

磁头无铅微焊点可靠性分析主要包括焊点前期液滴飞溅的防护和后期焊点失效性分析,在实际生产中,应用钎料球喷射连接技术时,钎料液滴飞溅时有发生,本文融合激光加热和氮气压力技术,建立了一种新的用于计算磁头内置DFH控制元件连接钎料液滴冲击速度的双液滴模型,同时,采用正交试验法对比了不同激光加热参数和氮气压力条件下磁头内置DFH控制元件连接钎料液滴飞溅的情况,并进一步融合可控扫描式磁场和偏置两种方法,研究了磁头微焊点的失效情况.试验结果表明:下落前,激光脉冲能量是决定液滴温度的主要因素;下落后,对钎料液滴温度影响最大的是钎料液滴的初始温度.磁头无铅微焊点失效是焊点液滴飞溅和金属间化合物共同作用的结果.

关键词: 钎料液滴飞溅, 氮气压力, 动态飞行高度(DFH), 双液滴模型

Abstract:

The reliability analysis for the magnetic head includes solders joint early drops splash protection and solders joint post failure analysis.In actual production,applying the jetting solder ball bonding (SBB) technology,solder splash have occurred frequently.Combining the laser heating and nitrogen pressure technology,this thesis aimed at building a new double of droplet model for calculating the striking velocity of the solder which is used to connect the Built-DFH in Slider,while different parameters of the laser heating and the nitrogen pressure are compared through the orthogonal test.The controllable scanning magnetic fields and bias are further incorporated and the failure of magnetic solder joint is studied.The results showed that before the solder falls,laser energy is the most important factor affecting the solder splash.After the solder falls,we find that the temperature of the melting ball has no decrease during the fall.The temperature of the impinging melting ball depends on its initial value.The failure of magnetic solder joint is caused by solder droplet splash and intermetallic compounds.

Key words: solder splash, nitrogen pressure, dynamic flying height, double droplet model

中图分类号:

TM271+.2

肖祥慧, 彭敏放, 贺建飚, 唐荣军, 周影良. 磁头无铅微焊点液滴飞溅和失效性分析[J]. 电子学报, 2015, 43(4): 769-775.

XIAO Xiang-hui, PENG Min-fang, HE Jian-biao, TANG Rong-jun, ZHOU Ying-liang. The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head[J]. Acta Electronica Sinica, 2015, 43(4): 769-775.

参考文献

[1] A P Newbery,T Rayment,P S Grant.A particle image velocimetry investigation of in-flight and deposition behavior of steel droplets during electric arc spray forming[J].Materials Science and Engineering,2004,383(A):137-145.
[2] 王晓林,李明宇,王青春.激光喷射钎料球键合工艺的影响因素分析[J].焊接,2010,12(12):38-42.
[3] 尹立孟,张新平.电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为[J].电子学报,2009,37(2):253-257. Yin Li-meng,Zhang Xin-ping.Electromigration induced brittle creep fracture behavior of lead-free solder micro-interconnections[J].Acta Electronica Sinica,2009,37 (2):253-257.(in Chinese)
[4] 黄春跃,周德检,吴兆华.基于正交试验设计法的塑封球栅阵列器件焊点工艺参数与可靠性关系研究[J].电子学报,2005,33 (5):788-792. Huang Chun-yue,Zhou De-jian,Wu Zhao-hua.Study on the relationships between solder joint process parameters and reliability of plastic ball grid array component based on the orthogonal experiment design[J].Acta Electronica Sinica,2005,33 (5):788-792.(in Chinese)
[5] 百度百科.液滴模型[EB/OL].http://baike.baidu.com/link?url=EjKvrxg87mHmLW0DGr9H6Q5bNQAjzY14o-b2j-TPBy3dw-3W-EdIRuU22c0DISJgzUmnNVyVTLDJ WPC83JBfFW1q.
[6] Lai ZhongMin,Xue SongBai,Han XiangPeng,et al.Study on microstructure and property of brazed joint of AgCuZn-X(Ga,Sn,In,Ni) brazing alloy[J].Rare Metal Materials and Engineering,2010,39(3):0397-0400.
[7] 肖祥慧,彭敏放,黎福海,等.磁头内置DFH控制元件可靠性的有限元分析[J].电子学报,2012,40 (10):2140-2144. Xiao Xiang-hui,Peng Min-fang,Li Fu-hai,et al.The finite element analysis forreliability of built-DFH in magnetic head[J].Acta Electronica Sinica,2012,40(10):2140-2144.(in Chinese)
[8] Gao Yan-fang,et al.Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution[J].Transactions on Nonferrous Met Soc China,2012,22(4):977-982.
[9] N Nikolopoulos,et al.Normal impingement of a droplet onto a wall film:A numerical investigation[J].International Journal of Heat and Fluid Flow,2005,26(1):119-132.
[10] Xiao Feng,Liu Lanxiao,et al.Measurement and analysis molten nickel-cobalt alloy surface tension[J].Rare Metal Materials and Engineering,2008,37 (2):255-258.
[11] Purvis,R-Smith F T.Droplet impact on water layers:Post-impact analysis and computations[J].Philosophical Transactions on Mathematical Physical and Engineering Sciences,2005,363 (1830):1209-1221.
[12] Yingzhi Chu,Wenlai Ma,et al.Crater forming process by liquid drop impacting liquid multi-layer target[J].Physics and Chemistry of Liquids,2004,42(2):135-146.
[13] V Roisman,Romain Rioboo,Cameron Tropea,Ilia.Normal impact of a liquid drop on a dry surface:Model for spreading and receding[J].Proceedings of the Royal Society of London -A,2002,458 (2022):1411-1430.
[14] Heng Xie,Seiichi Koshizuka,Yoshiaki Oka.Simulation of drop deposition process in annular mist flow using three-dimensional particle method[J].Nuclear Engineering and Design,2005,235(16):1687-1697.
[15] 吴敏,刘政军.磁场对Sn-9Zn钎料组织、显微硬度及电化学腐蚀的影响[J].中国有色金属学报,2012,22(2):485-489. Wu Min,Liu Zheng-jun.Effects of magnetic fields on microstructure,microhardness and electrochemical corrosion of Sn-9Zn solder[J].The Chinese Journal of Nonferrous Metals,2012,22(2):485-489.(in Chinese)
[16] C Weiss.The liquid deposition fraction of sprays impinging vertical walls and flowing films[J].International Journal of Multiphase Flow,2005,31(1):115-140.
[17] N Nikolopoulos,et al.Normal impingement of a droplet onto a wall film:A numerical investigation[J].International Journal of Heat and Fluid Flow,2005,26(1):119-132.
[18] Saeid Shakeri,Sanjeev Chandra.Splashing of molten tin dropletson a rough steel surface[J].International Journal of Heat and Mass Transfer,2002,45(23):4561-4575.
[19] R Ghafouri-Azar,J Mostaghimi,S Chandra.Numerical study of impact and solidification of a droplet over a deposited frozen splat[J].International Journal of Computational Fluid Dynamics,2004,18(2):133-138.
[20] 潘晓勇,龙旦风,杨继平.废旧电路板钎料吹扫去除试验研究[J].机械工程学报,2010,46(19):192-198.
[21] Marianne Francois,Wei Shyy.Computations of dynamics with the immersed boundary method,part 2:Drop impact and heat transfer[J].Numerical Heat Transfer,2003,44(2):119-143.

磁头无铅微焊点液滴飞溅和失效性分析

The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

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