纯相位硅基液晶器件的芯片级封装技术

doi:10.3969/j.issn.0372-2112.2015.11.027

电子学报 ›› 2015, Vol. 43 ›› Issue (11): 2322-2330.DOI: 10.3969/j.issn.0372-2112.2015.11.027

纯相位硅基液晶器件的芯片级封装技术

张紫辰, 尤政

清华大学精密仪器系, 精密测试技术及仪器国家重点实验室, 微纳制造器件与系统协同创新中心, 北京 100084

收稿日期:2014-05-04 修回日期:2014-09-19 出版日期:2015-11-25
- 作者简介:
- 张紫辰 男,1983年10月出生,北京市人,获得剑桥大学电气工程系博士学位,清华大学精密仪器系助理教授,主要从事MEMS微集成技术及液晶器件技术等工作的研究,已发表学术论文20余篇.E-mail:zz241@tsinghua.edu.cn;尤政男,1963年12月出生,江苏扬州人.教授,博士生导师,中国工程院院士,长江学者.现为清华大学机械工程学院院长、清华大学精密仪器系主任,主要研究领域为微米/纳米技术、微光机电系统集成、微纳卫星技术.E-mail:yz-dpi@tsinghua.edu.cn
- 基金资助:
- 博士后基金 (No.2013M530613); 清华大学自主科研项目 (No.20121087915)

Fundamentals of Die-Level Assembly Techniques for Phase-Only Liquid Crystal on Silicon Devices

ZHANG Zi-chen, YOU Zheng

State Key Laboratory of Precision Measurement Technology and Instrument, Collaborative Innovation Center for Micro/Nano Fabrication, Device and System, Department of Precision Instrument, Tsinghua University, Beijing 100084, China

Received:2014-05-04 Revised:2014-09-19 Online:2015-11-25 Published:2015-11-25
- Supported by:
- Post-doctoral Foundation (No.2013M530613); Independent Research Project of Tsinghua University (No.20121087915)

摘要/Abstract

摘要：

本文讨论了纯相位硅基液晶器件(liquid crystal on silicon device,LCOS)的芯片级封装技术.包括具体基础工艺介绍、关键工艺分析及封装检测、质量控制方法等.其中详细介绍了工艺步骤中的玻璃基板和硅基板的光学预先检测、基板清洗、取向层处理、胶水涂覆、组装封装及灌注液晶工艺.同时在密封胶水涂覆、灌注液晶及如何控制器件厚度的原则问题上做出了重点阐述,最后定义了优质封装质量的纯相位硅基液晶器件应该具备的基本要素.

关键词: 硅基液晶器件, 封装工艺, 光学检测, 液晶灌注, 取向层处理

Abstract:

This paper describes fundamentals of die-level assembly techniques for phase-only liquid crystal on silicon(LCOS) devices,which have not been in-depth discussed previously.The discussion contains the introduction to the basic assembly process,analysis to key assembly procedures,inspection to the assembled device and overall quality control including pre-assembly inspection and cleaning process for both glass and silicon backplane,alignment layer deposition with baking process,glue line processing,assembly and liquid crystal filling process.In particular,glue line writing,liquid crystal filling and overall quality assessment of assembly process have been substantially investigated.Finally,the excellent quality of assembled phase-only LCOS devices with characteristics have been defined.

Key words: liquid crystal on silicon, assembly technique, optical inspection, liquid crystal filling, alignment layer deposition

中图分类号:

TN305

张紫辰, 尤政. 纯相位硅基液晶器件的芯片级封装技术[J]. 电子学报, 2015, 43(11): 2322-2330.

ZHANG Zi-chen, YOU Zheng . Fundamentals of Die-Level Assembly Techniques for Phase-Only Liquid Crystal on Silicon Devices[J]. Acta Electronica Sinica, 2015, 43(11): 2322-2330.

参考文献

[1] Vettese D.MICRODISPLAYS Liquid crystal on silicon[J]. Nat Photonics 2010,Nov;4(11):752-754.
[2] J F Magana,L A Dass.Wafer level electro-optical sort testing and wafer level assembly of micro liquid crystal-on silicon(LCOS) devices[P]. US Patents,10/205,469,2005.
[3] H De Smet,J Van den Steen,P Colson.Use of stitching in microdisplay fabrication[J]. Proc.SPIE2002,4657:23.
[4] M Lu.Nematic liquid crystal technology for Si wafer-based reflective spatial light modulators[J]. J SID,2002,10(1):37-47.
[5] Z C Zhang,A M Jeziorska-Chapman,N Collings,M Pivnenko,J Moore,B Crossland,D P Chu,B Milne.High quality assembly of phase-only liquid crystal on silicon(LCOS) devices[J]. J Disp Technol,2011,7:120-126.
[6] A Choubey,F Andros,B G Sammakia.Study of assembly processes for liquid crystal on silicon(LCoS) microdisplays[J]. IEEE T Compon Pack T,2005,28:303-310.
[7] J L D delaTocnaye,L Dupont.Complex amplitude modulation by use of liquid-crystal spatial light modulators[J]. Appl Optics,1997,36:1730-1741.
[8] JVC D-ILA.[OL] http://dila.jvc.com/
[9] Z Zhang,A M.Jeziorska-Chapman,N Collings,M Pivnenko,J Moore,W I Milne,W A Crossland,D P Chu.High quality assembly of liquid crystal on silicon(LCOS) devices for phase-only holography[J]. Proc SPIE,2010,7618:76815.
[10] P T Kazlas,K M Johnson,D J McKnight.Miniature liquid-crystal-on-silicon display assembly[J]. Opt.Lett.1998,23:972.
[11] Zhang ZC,Yang HN,Robertson B,Redmond M,Pivnenko M,Collings N,et al.Diffraction based phase compensation method for phase-only liquid crystal on silicon devices in operation[J]. Appl Optics 2012 Jun 10;51(17):3837-3846.
[12] DeGennes,P G & Prost,J.The Physics of Liquid Crystals 161[M]. Clarendon,Oxford,1993.
[13] Stöhr J,et al.Microscopic origin of liquid crystal alignment on buffed polymer surfaces[J]. Macromolecules,1998,31:1942-1946.
[14] Stöhr,J & Samant,M G Liquid crystal alignment by rubbed polymer surfaces:A microscopic bond orientation model.J.Electron Spectrosc[J]. Rel.Phenom.1999,98-99:189-207.
[15] Robert B.Meyer.Point disclinations at a nematic-lsotropic liquid interface[J]. Molecular Crystals and Liquid Crystals,1972,16(4):355-369.
[16] Robert B.Meyer.On the existence of even indexed disclinations in nematic liquid crystals[J]. Philosophical Magazine.1973,27(2):405-424.
[17] M P Mahajan,C Rosenblatt.Correlation between rub-induced grooves in a polyimide-treated substrate and microstructure of rubbing fiber:An atomic force microscopy study[J]. Journal of Applied Physics,1998,83:7649-7652.
[18] M Schadt,K Schmitt,V Kozinkov,V Chigrinov.Surface-induced parallel alignment of liquid-rystals by linearly polymerized photopolymers[J]. Japanese Journal of Applied Physics Part 1-Regular Papers Short Notes & Review Papers,1992,31:2155-2164.
[19] P J Bos and K R Koehler-Beran.The pi-cell:a fast liquid-crystal optical-switching device[J]. Mol Cryst Liq Cryst,1984,113:329.
[20] Donald Davis,Scott Worthington.Offset printing of gasket seals for wafer scale processing of microdisplays[P]. US Patents 09/738,575,2002.

纯相位硅基液晶器件的芯片级封装技术

Fundamentals of Die-Level Assembly Techniques for Phase-Only Liquid Crystal on Silicon Devices

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