电子学报 ›› 2017, Vol. 45 ›› Issue (7): 1613-1619.DOI: 10.3969/j.issn.0372-2112.2017.07.010

• 学术论文 • 上一篇    下一篇

温度与振动耦合条件下的电路板级焊点失效模式与疲劳寿命分析

汤巍, 景博, 黄以锋, 盛增津, 胡家兴   

  1. 空军工程大学航空航天工程学院, 陕西西安 710038
  • 收稿日期:2016-01-14 修回日期:2016-05-17 出版日期:2017-07-25 发布日期:2017-07-25
  • 作者简介:汤巍,男,1987年出生,河北保定人,空军工程大学航空航天工程学院控制科学与工程专业博士研究生,主要研究方向为故障诊断、预测与健康管理.E-mail:rk1019@163.com;景博,女,1965年出生,河北邯郸人,空军工程大学教授,博士生导师.主要研究方向为故障诊断与容错控制、测试性设计与验证、信息物理融合系统.
  • 基金资助:

    陕西省自然科学基金(No.2015JM6345);航空科学基金(No.20142896022)

Analysis of Failure Modes and Life of Solder Joints Under Coupling of Vibration and Thermal Loads

TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, HU Jia-xing   

  1. Aeronautics and Astronautics Engineering College, Air Force Engineering University, Xi’an, Shaanxi 710038, China
  • Received:2016-01-14 Revised:2016-05-17 Online:2017-07-25 Published:2017-07-25

摘要:

基于正交试验法研究不同温度与振动耦合条件下的板级焊点失效行为与模式,采用L9(34)混合水平正交表设计了不同温度(T)、加速度功率谱密度(PSD)与频率(V)条件下的加速寿命试验,结果表明三者对焊点可靠性影响程度为T>PSD>V,且温度是影响焊点失效模式的主要因素,随温度的升高,焊点裂纹逐渐从近封装侧的界面金属化合物(IMC)层向钎体内部扩展,焊点失效模式从脆性断裂向韧性断裂演化.基于焊点失效数据分析,发现焊点疲劳寿命对数值与PCB板背侧最大应变范围存在关联关系,并采用多项式拟合的方法建立了焊点疲劳寿命模型,拟合结果显示,该模型能较好的评估温度与振动耦合条件下的焊点寿命,预测精度较高.

关键词: 温度与振动耦合, 焊点, 失效模式, 疲劳寿命

Abstract:

The failure behavior and modes of board level solder joints under coupling of vibration and thermal loads were studied based on the orthogonal experiment design method.The accelerated life tests with different temperature (T),power spectral density (PSD) and frequency (V) were conducted by using a L9(34) mixed-level orthogonal array.The results show that the degree of influence that the three factors have on the reliability of solder joints is T>PSD>V.The temperature is the main factor that can affect the failure modes of solder joints significantly.The crack initiates in the intermetalic compound (IMC) and propagates into the bulk solder gradually as the temperature rise.The failure mode evolves from the brittle fracture to ductile fracture.Based on the analysis of the failure data,a fatigue life model of solder joint was developed by using the polynomial fitting method,according to the relationship between the logarithmic fatigue life value and the strain range of the back side of the printed circuit board.The fitting results indicate that the model can evaluate the fatigue life of solder joints under the coupling of the vibration and thermal loads accurately.

Key words: coupling of vibration and thermal loads, solder joint, failure mode, failure life

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