基于再流焊冷却过程应力分析的板极组件BGA焊点参数优化

doi:10.3969/j.issn.0372-2112.2020.06.011

电子学报 ›› 2020, Vol. 48 ›› Issue (6): 1117-1123.DOI: 10.3969/j.issn.0372-2112.2020.06.011

基于再流焊冷却过程应力分析的板极组件BGA焊点参数优化

唐香琼¹, 黄春跃¹, 梁颖², 匡兵¹, 赵胜军¹

1. 桂林电子科技大学机电工程学院, 广西桂林 541004;
2. 成都航空职业技术学院信息工程学院, 四川成都 610021

收稿日期:2019-03-19 修回日期:2019-08-09 出版日期:2020-06-25
- 通讯作者:
- 黄春跃
- 作者简介:
- 唐香琼 女,1994年4月出生于广西桂林.桂林电子科技大学机电工程学院机械工程硕士.研究方向为微电子封装与组装可靠性技术.E-mail:2804684192@qq.com
- 基金资助:
- 军委装备发展部"十三五"装备预研领域基金项目; 广西科技重大专项 (桂科） (No.AA19046004）; 四川省科技计划资助项目 (No.2018JY0292）

Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process

TANG Xiang-qiong¹, HUANG Chun-yue¹, LIANG Ying², KUANG Bing¹, ZHAO Sheng-jun¹

1. School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China;
2. School of Electronical and Information Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu, Sichuan 610021, China

Received:2019-03-19 Revised:2019-08-09 Online:2020-06-25 Published:2020-06-25
- Corresponding author:
- HUANG Chun-yue
- Supported by:
- Program supported by Equipment Pre-research Field Fund of CMC Equipment Development Department during the 13th Five-year Plan; Science and Technology Major Project of Guangxi Zhuang Autonomous Region (Guangxi Academy of Sciences) (No.AA19046004); Program supported by Sichuan Science and Technology Program (No.2018JY0292)

摘要/Abstract

摘要： 建立了板级组件BGA（Ball Grid Array）焊点有限元分析模型，对BGA焊点进行了再流焊冷却过程应力仿真分析，设计并完成了验证性实验以验证仿真分析方法的有效性，分析了焊点结构参数和材料变化对焊点再流焊冷却过程应力应变的影响，采用响应面法建立了焊点应力与结构参数的回归方程，结合遗传算法对焊点结构参数进行了优化.结果表明：实验结果证明了仿真分析的有效性；焊点应力随着焊点高度的增加而增大，随着焊点直径的增加而减小；最优焊点结构参数水平组合为：焊点高度0.44mm、焊点直径0.65mm、焊盘直径0.52mm和焊点间距1.10mm；对该最优焊点仿真验证表明最大应力下降了0.1101MPa.

关键词: 板级组件BGA焊点, 再流焊冷却过程, 应力应变, 响应面分析, 遗传算法

Abstract: A finite element model of board level assembly BGA (Ball Grid Array) solder joint is established, the stress simulation analysis of BGA solder joint in the cooling process of reflow soldering is carried out, the confirmatory experiment is designed and carried out to verify the validity of simulation analysis method, and the influence of solder joint structure parameters and material on the stress and strain of solder joint are analyzed. The regression equations of the stress and structure parameters of the solder joints is established by the response surface method, and solder joint structure parameters are optimized by genetic algorithm. The results show that the experiment results verify the effectiveness of the simulation analysis, the stress of the solder joint increases with the increase of the height of the solder joint, and decreases with the increase of the diameter of the solder joint, and the optimal level combination of solder joint structure parameters is the height of 0.44mm, the diameter of 0.65mm, the pad diameter of 0.52mm and the solder joint pitch of 1.10mm, the simulation results of the optimal level combination of solder joint show that the maximum stress decreases by 0.1101MPa.

Key words: board level assembly BGA solder joint, cooling process of reflow, stress and strain, response surface analysis, genetic algorithm

中图分类号:

TG404

唐香琼, 黄春跃, 梁颖, 等. 基于再流焊冷却过程应力分析的板极组件BGA焊点参数优化[J]. 电子学报, 2020, 48(6): 1117-1123.

TANG Xiang-qiong, HUANG Chun-yue, LIANG Ying, et al. Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process[J]. Acta Electronica Sinica, 2020, 48(6): 1117-1123.

参考文献

[1] 黄春跃,韩立帅,梁颖,李天明,黄根信.微尺度CSP焊点温振耦合应力应变有限元分析[J].振动与冲击,2018,37(15):171-178. Huang Chunyue,Han Lishuai,Liang Ying,Li Tianming,Huang Genxin.Finite-element analysis of temperature-vibration coupling stress and strain for microscale CSP solder joint[J].Journal of Vibration and Shock,2018,37(15):171-178.(in Chinese)
[2] 汤巍,景博,黄以锋,盛增津,胡家兴.温度与振动耦合条件下的电路板级焊点失效模式与疲劳寿命分析[J].电子学报,2017,45(07):1613-1619. Tang Wei,Jing Bo,Huang Yifeng,Sheng Zengjin,Hu Jiaxing.Analysis of failure modes and life of solder joints under coupling of vibration and thermal loads[J].Acta Electronica Sinica,2017,45(07):1613-1619.(in Chinese)
[3] 魏鹤琳,王奎升.回流焊冷却过程中PBGA焊点力学行为分析[J].焊接学报,2012,33(07):85-88. Wei Helin,Wang Kuisheng.Mechanical behavior of PBGA lead-free solder joints under cooling process of reflow soldering[J].Transactions of the China Welding,2012,33(07):85-88.(in Chinese)
[4] 姚焕.基于Ansys Icepak的板级回流焊接建模与仿真[D].廊坊:北华航天工业学院,2018. Yao Huan.Modeling and Simulation of Board Level Reflowbased on Ansys Icepak[D].Langfang:North China Institute of Aerospace Engineering,2018.(in Chinese)
[5] 徐波.无铅回流焊冷却速率对焊点质量的影响[D].哈尔滨:哈尔滨工业大学,2006. Xu Bo,Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering[D].Haerbin:Harbin Institute of Technology,2006.(in Chinese)
[6] Ochoa F,Williams J J,Chawla N.Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5Ag solder[J].Journal of Electronic Materials,2003,32(12):1414-1420.
[7] Chun-Sean Lau,M Z Abdullah,C Y Khor.Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method[J].Microelectronics International,2013,30(3):151-168.
[8] W H Zhong,Y C Chan,M O Alam,B Y Wu,J F Guan.Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints[J].Journal of Alloys and Compounds,2013,30(3):151-168.
[9] 田茹玉,王晨曦,田艳红,赵利有.极限温度下CBGA焊点热冲击疲劳寿命预测[J].焊接学报,2017,38(10):93-97. Tian Ruyu,Wang Chenxi,Tian Yanhong,Zhao Liyou.Life prediction of CBGA soldered joints under extreme temperature thermal shock[J].Transactions of the China Welding,2017,38(10):93-97.(in Chinese)
[10] Heinrich S M,Schaefer M,Schroeder S A,et al.Prediction of solder joint geometries in array-type interconnects[J].Journal of Electronic Packaging,1996,118(3):114.
[11] 王建培,黄春跃,梁颖,等.基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化[J].电子学报,2019,47(3):734-740. Wang Jianpei,Huang Chunyue,Liang Ying,et al.Stress-strain analysis and optimization of CSP solder joint power load-harmonic response based on response surface analysis and genetic algorithm[J].Acta Electronica Sinica,2019,47(3):734-740.(in Chinese)

[1]	李杨帅, 彭斐, 韩倩, 李小帅, 解光军. 一种针对QCA电路自动布局布线的混合策略研究[J]. 电子学报, 2023, 51(3): 666-674.
[2]	钱忠胜, 俞情媛, 宋涛, 朱懿敏, 祝洁, 赵畅. 基于支持向量机回归模型的测试用例生成与重用[J]. 电子学报, 2021, 49(7): 1386-1391.
[3]	刘焕淋, 黄美娜, 陈勇, 杨健, 黄冰川, 张彤. 基于NOMA技术的PLC-VLC用户配对和子载波分配方法[J]. 电子学报, 2021, 49(10): 1952-1959.
[4]	金泽芬芬, 侯志强, 余旺盛, 王鑫, 寇人可. 基于量子遗传算法的视觉目标跟踪[J]. 电子学报, 2020, 48(8): 1493-1501.
[5]	薛河, 苟思育, 倪陈强. 紧凑拉伸试样参比电位差接线点布局的优化方法[J]. 电子学报, 2020, 48(7): 1396-1402.
[6]	郭广颂, 陈良骥, 文振华, 张勇. 求解高维混合指标优化问题的交互式进化计算[J]. 电子学报, 2020, 48(7): 1361-1368.
[7]	范书平, 张岩, 马宝英, 万里, 姚念民, 宋妍. 基于均衡优化理论的路径覆盖测试数据进化生成[J]. 电子学报, 2020, 48(7): 1303-1310.
[8]	徐超群, 易忠, 孟立飞, 刘超波, 黄魁. 基于遗传算法的卫星磁模型研究[J]. 电子学报, 2020, 48(6): 1108-1112.
[9]	梁颖, 黄春跃, 邹涯梅, 高超, 匡兵. 基于扭转载荷的微尺度CSP焊点应力应变分析与优化[J]. 电子学报, 2020, 48(10): 2033-2040.
[10]	段毅, 谭贤四, 曲智国, 王红. 基于分支定界法的相控阵雷达事件调度算法[J]. 电子学报, 2019, 47(6): 1309-1315.
[11]	李军华, 黎明, 陈昊, 伍家驹. 正态随机噪声环境下遗传算法的动态适应度评价[J]. 电子学报, 2019, 47(3): 649-656.
[12]	王建培, 黄春跃, 梁颖, 邵良滨. 基于回归分析和遗传算法的BGA焊点功率载荷热应力分析与优化[J]. 电子学报, 2019, 47(3): 734-740.
[13]	曲志坚, 陈宇航, 李盘靖, 刘晓红, 李彩虹. 基于多算子协同进化的自适应并行量子遗传算法[J]. 电子学报, 2019, 47(2): 266-273.
[14]	夏春艳, 张岩, 万里, 宋妍, 肖楠, 郭冰. 基于否定选择遗传算法的路径覆盖测试数据生成[J]. 电子学报, 2019, 47(12): 2630-2638.
[15]	陈卓, 冯钢, 刘蓓, 周杨. 运营商网络中面向时延优化的服务功能链迁移重配置策略[J]. 电子学报, 2018, 46(9): 2229-2237.

基于再流焊冷却过程应力分析的板极组件BGA焊点参数优化

Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

编辑推荐

Metrics