基于扭转载荷的微尺度CSP焊点应力应变分析与优化

doi:10.3969/j.issn.0372-2112.2020.10.022

电子学报 ›› 2020, Vol. 48 ›› Issue (10): 2033-2040.DOI: 10.3969/j.issn.0372-2112.2020.10.022

基于扭转载荷的微尺度CSP焊点应力应变分析与优化

梁颖¹, 黄春跃², 邹涯梅¹, 高超², 匡兵²

1. 成都航空职业技术学院信息工程学院, 四川成都 610021;
2. 桂林电子科技大学机电工程学院, 广西桂林 541004

收稿日期:2019-06-19 修回日期:2019-12-26 出版日期:2020-10-25
- 作者简介:
- 梁颖女,1974年生于四川成都,硕士,现为四川成都航空职业技术学院信息工程学院教授,主要研究方向为微电子封装可靠性技术、计算机控制与电路仿真及计算机应用技术.E-mail:almaliang@sina.com
  黄春跃 男,1971年出生于广西龙州,博士,现为桂林电子科技大学机电工程学院教授、博士生导师,主要研究方向微电子封装与组装可靠性技术.E-mail:hcymail@126.com
  邹涯梅 女,1979年生于四川自贡,硕士,现为四川成都航空职业技术学院汽车工程学院副教授,主要研究方向为汽车电子技术、通信技术及计算机辅助设计等.E-mail:zymyaya@163.com
- 基金资助:
- 四川省科技计划 (No.2018JY0292）; 军委装备发展部"十三五"装备预研领域基金; 广西自然科学基金 (No.2019JJA160101）; 桂林电子科技大学研究生教育创新计划 (No.2020YCXS012）

Stress and Strain Analysis and Optimization of Micro-scale CSP Solder Joints Based on Torsion Load

LIANG Ying¹, HUANG Chun-yue², ZOU Ya-mei¹, GAO Chao², KUANG Bing²

1. School of Electronical and Information Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu, Sichuan 610021, China;
2. School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin, Guangxi 541004, China

Received:2019-06-19 Revised:2019-12-26 Online:2020-10-25 Published:2020-10-25
- Supported by:
- Sichuan Science and Technology Program (No.2018JY0292); Armament Pre-research Field Fund of CMC Equipment Development Department during the 13th Five-year Plan; Natural Science Foundation of Guangxi Zhuang Autonomous Region, China (No.2019JJA160101); Postgraduate Education Innovation Plan of Guilin University Of Electronic Technology (No.2020YCXS012)

摘要/Abstract

摘要： 建立了微尺度芯片尺寸封装焊点有限元分析模型并对其进行扭转应力应变仿真分析与实验验证.分析了焊点材料、焊点直径、焊盘直径和焊点高度对焊点扭转应力应变的影响；以焊点材料、焊点直径、焊盘直径和焊点高度为设计变量，采用响应面法设计了29组不同水平组合的焊点模型并获取了相应焊点扭转应力，建立了焊点扭转应力与焊点结构参数的回归方程，结合遗传算法对焊点结构参数进行了优化.结果表明：焊点材料为SAC305时扭转应力应变最大，焊点最大扭转应力应变随焊点直径和焊盘直径增加而减小、随焊点高度增大而增大；最优焊点结构参数水平组合为：焊点材料SAC305、焊点直径0.22mm、焊盘直径0.14mm和焊点高度0.14mm；仿真验证表明最优焊点最大扭转应力下降了3.7MPa.

关键词: 微尺度焊点, 扭转载荷, 应力应变, 响应面分析, 遗传算法

Abstract: The finite element analysis model of micro-scale chip scale package (CSP) solder joints is set up and stress and strain analysis are performed under torsion load, and the verification experiment is also carried out. The influence of solder joint diameter, solder joint diameter, pad diameter and solder joint height on the torsion stress and strain of micro-scale CSP solder joints are analyzed. The solder joint material, solder joint diameter, pad diameter and solder joint height are selected as design variables; 29 groups of solder joints with different levels are designed and simulated by response surface methodology. The regression equation of solder joint torsion stress and structural parameters is established. The structural parameters of solder joint are optimized based on the regression equation and genetic algorithm. The results show that the maximum torsion stress and strain occurs with the solder joints material of SAC305, the maximum solder joint torsion stress and strain decreases with the increase of solder joint diameter and pad diameter, and increases with the increase of solder joint height; the optimal combination of solder joint level is the solder joint material of SAC305, the solder joint diameter of 0.22mm, the pad diameter of 0.14 mm and the solder joint height of 0.14mm, and simulation verification result shows the maximum stress of the solder joint decreases by 3.7MPa after optimization.

Key words: micro-scale solder joints, torsion load, stress and strain, response surface analysis, genetic algorithm

中图分类号:

TG404

梁颖, 黄春跃, 邹涯梅, 等. 基于扭转载荷的微尺度CSP焊点应力应变分析与优化[J]. 电子学报, 2020, 48(10): 2033-2040.

LIANG Ying, HUANG Chun-yue, ZOU Ya-mei, et al. Stress and Strain Analysis and Optimization of Micro-scale CSP Solder Joints Based on Torsion Load[J]. Acta Electronica Sinica, 2020, 48(10): 2033-2040.

参考文献

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基于扭转载荷的微尺度CSP焊点应力应变分析与优化

Stress and Strain Analysis and Optimization of Micro-scale CSP Solder Joints Based on Torsion Load

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