电子学报 ›› 2020, Vol. 48 ›› Issue (12): 2487-2492.DOI: 10.3969/j.issn.0372-2112.2020.12.026

• 科研通信 • 上一篇    下一篇

基于ANSYS的射频功率放大器热特性研究

李军1, 尹希雷1, 代法亮1, 朱佳垟1, 刘春秀1, 应祥岳2, 刘太君1   

  1. 1. 宁波大学信息科学与工程学院, 浙江宁波 315211;
    2. 浙江工商职业技术学院, 浙江宁波 315012
  • 收稿日期:2019-05-13 修回日期:2020-07-15 出版日期:2020-12-25 发布日期:2020-12-25
  • 通讯作者: 李军
  • 作者简介:尹希雷 男,硕士研究生.主要研究方向为无线通信技术、射频功率放大器设计.E-mail:yinxilei633@163.com
  • 基金资助:
    国家自然科学基金面上项目(No.61571251);宁波市自然科学基金(No.2018A610024);宁波市教育科学规划重点课题(No.2019YZD004)

The Research on Thermal Characteristics of RF Power Amplifier Based on ANSYS

LI Jun1, YIN Xi-lei1, DAI Fa-liang1, ZHU Jia-yang1, LIU Chun-xiu1, YING Xiang-yue2, LIU Tai-jun1   

  1. 1. Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, Zhejiang 315211, China;
    2. Zhejiang Business Technology Institute, Ningbo, Zhejiang 315012, China
  • Received:2019-05-13 Revised:2020-07-15 Online:2020-12-25 Published:2020-12-25

摘要: 论文首先仿真设计了一款射频功率放大器,接着构建了该射频功率放大器热特性分析模型,并采用有限元方法分析了该射频功率放大器热特性,然后研究了增加过孔以及不同覆铜层厚度、环境温度、耗散功率四种情况对射频功率放大器的温度、热应力和热形变的影响,最后基于上述分析结论加工制作并测试了该款射频功率放大器.在3.3GHz~3.6GHz范围内其输出功率不低于39.2dBm,增益不低于12dB,功率附加效率为62.6%~69%;在环境温度为21℃下,运用红外温度扫描仪进行测试,该款射频功率放大器最高温度达到90.0℃,测试结果与仿真分析结果相近.论文的研究为未来射频功率放大器的设计及制作提供了重要指导.

关键词: 射频功率放大器, 热分析, 温度, 热应力, 热形变

Abstract: At first,a design and simulation of a RF power amplifier is presented.Then,the thermal characteristics analysis model of the RF power amplifier is built and the thermal characteristics of the RF power amplifier is analyzed by using the finite element method.After that the effects of increasing the through hole and different copper coating thickness,environmental temperature and dissipative power on the temperature,thermal stress and thermal deformation of the RF power amplifier are studied.Based on the above analysis,the RF power amplifier is fabricated and measured at last.In the frequency range of 3.3GHz to 3.6GHz,power added efficiency is from 62.6% to 69% with output power greater than 39.2dBm and gain larger than 12dB.When the ambient temperature is 21℃,the maximum temperature of the RF power amplifier reaches 90.0℃,and the test results are close to the simulation analysis results.The research of this paper provides important guidance for the design and manufacture of RF power amplifier in the future.

Key words: RF power amplifier, thermal analysis, temperature, thermal stress, thermal deformation

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