[1] 王真,江建慧.基于概率转移矩阵的串行电路可靠度计算方法[J].电子学报,2009,37(2):24 1-247. WANG Zhen,JIANG Jian-hui.A serial method of circuit reliability calculation bas ed on probabilistic transfer matrix [J].Acta Electronica Sinica,2009,37(2):241 -247.(in Chinese)[2] J Xiao,J-H Jiang,X-G Zhu.A method of gate-level circuit reliability estimatio n based on iterative PTM model[A].Proceeding of IEEE 17th Pacific Rim Interna tional Symposium on Dependable Computing[C].Los Alamitos:IEEE Computer Society ,2011.276-277.[3] Han J,Hao C,Erin B.Reliability evaluation of logic circuits using probabilistic gate models[J].Microelectron Reliability,2011,51(2):468-476.[4] 王真,江建慧.考虑版图级因素的PTM中故障感染率的计算[J].哈尔滨工业大学学报,2009,4 1(S):124-129. Wang Zhen,Jiang Jian-hui.The calculation of fault infection probability in PTM considering factors of layout[J].Journal of Harbin Institute of Technology,200 9,41(S):124-129.(in Chinese)[5] 肖杰,江建慧.结合版图结构信息的基本门电路故障概率估计[J].电子学报,2012,40(2):23 5-240. Xiao Jie,Jiang Jian-hui.The estimation of fault probability of elementary gates based on the layout structure information[J].Acta Electronica Sinica,2012,40( 2):235-240.(in Chinese)[6] J-X Fang,S S Sapatnekar.Scalable methods for the analysis and optimization of g ate oxide breakdown[A].Proceeding of IEEE 11th International Symposium on Qual ity Electronic Design[C].Los Alamitos:IEEE Computer Society,2010.638-645.[7] MIL-HDBK-344A.Military handbook:Environmental stress screening of electronic e quipment[S].[8] Liew B K,Fang P,Hu C M.Circuit reliability simulator for interconnect,via,and co ntact electromigration[J].IEEE Transactions on Electronic Devices,1992,39(11) :2472-2479.[9] Li B Z,Christiansen C,Gill J,et al.Threshold electromigration failure time and i ts statistics for Cu interconnects[J].Journal of Applied Physics,2006,100(1145 16):1-10.[10] Fischer A H,Abel A,Lepper M,et al.Modeling bimodal electromigration failure dist ributions[J].Microelectronics Reliability,2001,41(3):445-453.[11] 辛维平,庄奕琪,李小明.片上栅氧化经时击穿失效监测电路与方法[J].电子学报,2012,40(11):2188-2193. Xin Wei-ping,Zhuang Yi-qi,Li Xiao-ming.An on-chip circuit for monitoring fai lure due to TDDB[J].Acta Electronica Sinica,2012,40(11):2188-2193.(in Chinese)[12] Wu E Y,Sune J.Power law voltage acceleration:a key element for ultra-thin gate oxide reliability[J].Microelectronic Reliability,2005,45(12):1809-1834.[13] Wu E Y,Nowak W J,Vayshenker A,et al.CMOS scaling beyond the 100-nm node with si licon-dioxide-based gate dielectrics[J].IBM Journal of Research and Developm ent,2002,46(2/3):287-298.[14] Jong H P,Byung T A.Electromigration model for the prediction of lifetime based o n the failure unit statistics in aluminum metallization[J].Journal of Applied Physics,2003,93(2):883-892. |