磁头无铅微焊点液滴飞溅和失效性分析

doi:10.3969/j.issn.0372-2112.2015.04.020

电子学报 ›› 2015, Vol. 43 ›› Issue (4): 769-775.DOI: 10.3969/j.issn.0372-2112.2015.04.020

磁头无铅微焊点液滴飞溅和失效性分析

肖祥慧¹, 彭敏放¹, 贺建飚², 唐荣军³, 周影良³

1. 湖南大学电气与信息工程学院, 湖南长沙 410082;
2. 中南大学信息科学与工程学院, 湖南长沙 410083;
3. 日本TDK集团, 广东东莞 523000

收稿日期:2014-05-21 修回日期:2014-06-30 出版日期:2015-04-25
- 作者简介:
- 肖祥慧 男,1983年9月出生,湖南邵阳人.湖南大学电气与信息工程学院电气工程专业博士研究生、讲师.主要从事接地网故障诊断,智能电网、电磁场理论及其应用,智能信息处理等方面的研究工作.E-mail:xiaoen3@126.com;彭敏放 女,1964年3月生,湖南湘乡人,1991年、2006年分别在湖南大学获得工学硕士和工学博士学位,现为湖南大学电气与信息工程学院教授、博士生导师,湖南省新世纪121人才工程人选,主要从事电路测试与诊断、智能信息处理、电力系统故障分析及其设备状态监测、电磁场理论及其应用等方面的研究工作.E-mail:pengminfang@hnu.edu.cn
- 基金资助:
- 国家自然科学基金 (No.61173108,No.60973032,No.60673084,No.61272147); 湖南省自然科学基金 (No.10JJ2045); 湖南省学位与研究生教育教改 (No.JG2011C004)

The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

XIAO Xiang-hui¹, PENG Min-fang¹, HE Jian-biao², TANG Rong-jun³, ZHOU Ying-liang³

1. Institute of Electrical and Information Engineering, Hunan University, Changsha, Hunan 410082, China;
2. School of Information Science and Engineering, Central South University, Changsha, Hunan 410083, China;
3. Japan's TDK Groups, Dongguan, Guangdong 523000, China

Received:2014-05-21 Revised:2014-06-30 Online:2015-04-25 Published:2015-04-25

摘要/Abstract

摘要：

磁头无铅微焊点可靠性分析主要包括焊点前期液滴飞溅的防护和后期焊点失效性分析,在实际生产中,应用钎料球喷射连接技术时,钎料液滴飞溅时有发生,本文融合激光加热和氮气压力技术,建立了一种新的用于计算磁头内置DFH控制元件连接钎料液滴冲击速度的双液滴模型,同时,采用正交试验法对比了不同激光加热参数和氮气压力条件下磁头内置DFH控制元件连接钎料液滴飞溅的情况,并进一步融合可控扫描式磁场和偏置两种方法,研究了磁头微焊点的失效情况.试验结果表明:下落前,激光脉冲能量是决定液滴温度的主要因素;下落后,对钎料液滴温度影响最大的是钎料液滴的初始温度.磁头无铅微焊点失效是焊点液滴飞溅和金属间化合物共同作用的结果.

关键词: 钎料液滴飞溅, 氮气压力, 动态飞行高度(DFH), 双液滴模型

Abstract:

The reliability analysis for the magnetic head includes solders joint early drops splash protection and solders joint post failure analysis.In actual production,applying the jetting solder ball bonding (SBB) technology,solder splash have occurred frequently.Combining the laser heating and nitrogen pressure technology,this thesis aimed at building a new double of droplet model for calculating the striking velocity of the solder which is used to connect the Built-DFH in Slider,while different parameters of the laser heating and the nitrogen pressure are compared through the orthogonal test.The controllable scanning magnetic fields and bias are further incorporated and the failure of magnetic solder joint is studied.The results showed that before the solder falls,laser energy is the most important factor affecting the solder splash.After the solder falls,we find that the temperature of the melting ball has no decrease during the fall.The temperature of the impinging melting ball depends on its initial value.The failure of magnetic solder joint is caused by solder droplet splash and intermetallic compounds.

Key words: solder splash, nitrogen pressure, dynamic flying height, double droplet model

中图分类号:

TM271+.2

肖祥慧, 彭敏放, 贺建飚, 唐荣军, 周影良. 磁头无铅微焊点液滴飞溅和失效性分析[J]. 电子学报, 2015, 43(4): 769-775.

XIAO Xiang-hui, PENG Min-fang, HE Jian-biao, TANG Rong-jun, ZHOU Ying-liang. The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head[J]. Acta Electronica Sinica, 2015, 43(4): 769-775.

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磁头无铅微焊点液滴飞溅和失效性分析

The Droplet Splashing Study and Failure Analysis for the Lead-Free Micro Solders Joint of the Magnetic Head

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