3D芯片绑定中测试绑定次序对成本的影响
方芳, 秦振陆, 王伟, 朱侠, 郭二辉, 任福继
The Bonding Order's Impact on Cost During Mid-Bond Test of 3D Chip
FANG Fang, QIN Zhen-lu, WANG Wei, ZHU Xia, GUO Er-hui, REN Fu-ji
电子学报
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2017, (9): 2263
-2271
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DOI: 10.3969/j.issn.0372-2112.2017.09.030
