热循环加载条件下焊点形态参数对板级光互连模块对准偏移影响分析
吴松, 黄春跃, 梁颖, 李天明, 郭广阔, 熊国际, 唐文亮
Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset Under Thermal Cycling Load
WU Song, HUANG Chun-yue, LIANG Ying, LI Tian-ming, GUO Guang-kuo, XIONG Guo-ji, TANG Wen-liang
电子学报
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2015, (6): 1179
-1184
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DOI: 10.3969/j.issn.0372-2112.2015.06.021
