Electrical Characteristics Modeling and Degradation Analysis of QFP Package Interconnect Structure

HU Jia-xing, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, CHEN Yao-jun, ZHANG Yu-lin

Acta Electronica Sinica ›› 2019, Vol. 47 ›› Issue (2) : 366-373.

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Acta Electronica Sinica ›› 2019, Vol. 47 ›› Issue (2) : 366-373. DOI: 10.3969/j.issn.0372-2112.2019.02.016

Electrical Characteristics Modeling and Degradation Analysis of QFP Package Interconnect Structure

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 47(2): 366-373 https://doi.org/10.3969/j.issn.0372-2112.2019.02.016

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