A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding
LIU Jun, XIA Shan-hong, PENG Chun-rong, CHU Zhao-zhi, LEI Hu-cheng, LIU Xiang-ming, ZHANG Zhou-wei, ZHANG Wei, PENG Si-min, GAO Ya-hao
Acta Electronica Sinica
.
2023, (9): 2517
-2525
.
DOI: 10.12263/DZXB.20211364
