1. 上海电力学院计算机与信息工程学院,上海,200090
2. 武汉大学集成电路与通讯软件系,湖北,武汉,430079
3. 苏州大学电子信息学院,江苏,苏州,215021
4. 朗讯科技光网络有限公司,上海,200233
5. 上海电力学院计算机与信息工程学院上海,200090
6. 武汉大学集成电路与通讯软件系湖北武汉,430079
7. 苏州大学电子信息学院江苏苏州,215021
8. 朗讯科技光网络有限公司上海,200233
纸质出版:2010
移动端阅览
叶 波, 李天望, 张立军, 等. PDH到622Mb/sSDH/SONET映射芯片实现[J]. 电子学报, 2010,38(8):1945-1951.
YE Bo, LI Tian-wang, ZHANG Li-jun, et al. Chip Implementation for PDH over 622 Mb/s SDH/SONET Mapper[J]. Acta Electronica Sinica, 2010, 38(8): 1945-1951.
设计了PDH到622 Mb/s SDH/SONET的映射及逆映射芯片.集成了DS1/E1/J1成帧器、DS1/DS3复接电路和E1/E3复接电路
具有622 Mb/s和155 Mb/s的高速标准接口和3通道STM-1/STS-3分插复用总线接口
支持复用段1+1保护和UPSR环形网络拓扑结构.单片实现84通道DS1/J1或63通道E1到STM-1/STS-3的映射复用功能及多通道DS3/E3/STS-1到STM-4/STS-12的映射复用功能.支持点对点应用和环形应用
交换模式支持2016通道DS0/E0的应用.4颗芯片实现336通道DS1/J1或252通道E1到STM-4/STS-12的映射复用功能.采用TSMC 0.13 μm CMOS工艺流片
芯片规模约600万门
700管脚 PGBA封装
满足光纤通信传输的要求
并成功用于光纤通信设备.
A PDH to 622 Mb/s SDH/SONET mapping de-mapping chip is proposed in this paper
which integrates DS1/E1/J1 framer
DS1/DS3 multiplexer and E1/E3 multiplexer.It provides high speed interface for 622 Mb/s and 155 Mb/s SDH/SONET signals and three add-drop-multiplexer bus interfaces for STM-1/STS-3 signals.It supports both MSP 1+1 protection switching and ring (UPSR) network topologies.A single chip can provide complete STM-1/STS-3 mapping de-mapping for up to 84 DS1/ J1 or 63 E1 signals
and STM-4/STS-12 mapping de-mapping for several DS3/E3/STS-1 signals.Point-to-point and ring applications are supported
and in switching mode 2016 DS0/E0 application is supported.Four chips can implement complete STM-4/STS-12 mapping de-mapping for 336 DS1/J1 or 252 E1 tributary signals.The chip is fabricated in TSMC 0.13 μm CMOS process and the gate count is about 6 million.It is packaged with 700-pin PGBA technology and meets optical network transmission requirement.It has been successfully used in optical network communication devices.
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