用于5G通信的射频微系统与天线一体化三维扇出型集成封装

夏晨辉, 王刚, 王波, 明雪飞

Integrated 3D Fan-Out Package of RF Microsystem and Antenna for 5G Communication

XIA Chen-hui, WANG Gang, WANG Bo, MING Xue-fei

电子学报 . 2023, (6): 1572 -1580 . DOI: 10.12263/DZXB.20210991