基于SOI-SOG键合的圆片级真空封装MEMS电场传感器
刘俊, 夏善红, 彭春荣, 储昭志, 雷虎成, 刘向明, 张洲威, 张巍, 彭思敏, 高雅浩
A Wafer-Level Vacuum Packaged MEMS Electric Field Sensor Based on SOI-SOG Bonding
LIU Jun, XIA Shan-hong, PENG Chun-rong, CHU Zhao-zhi, LEI Hu-cheng, LIU Xiang-ming, ZHANG Zhou-wei, ZHANG Wei, PENG Si-min, GAO Ya-hao
电子学报
.
2023, (9): 2517
-2525
.
DOI: 10.12263/DZXB.20211364
