考虑布线-通孔的陶瓷封装基板嵌入式微流道设计
彭博, 王明阳, 淦作腾, 刘林杰, 杜平安
Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole
PENG Bo, WANG Ming-yang, GAN Zuo-teng, LIU Lin-jie, DU Ping-an
电子学报
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2024, (11): 3899
-3906
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DOI: 10.12263/DZXB.20230998
