基于热叠加模型的叠层3D多芯片组件芯片热布局优化研究
梁 颖;黄春跃;阎德劲;李天明
Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model
LIANG Ying;HUANG Chun-yue;YAN De-jin;LI Tian-ming
电子学报 . 2009, (11): 2520 -2524 .