热致封装效应对MEMS器件谐振特性影响的单元库模型

宋竞;黄庆安;唐洁影

Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device

SONG Jing;HUANG Qing-an;TANG Jie-ying

电子学报 . 2008, (5): 943 -947 .