振动载荷下面向电子设备PHM的板级封装潜在故障分析方法
汤巍, 景博, 黄以锋, 盛增津, 焦晓璇
Latent Fault Analysis of Board-Level Package for Electronics PHM Subjected to Vibration
TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, JIAO Xiao-xuan
电子学报
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2016, (4): 944
-951
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DOI: 10.3969/j.issn.0372-2112.2016.04.027
