温度与振动耦合条件下的电路板级焊点失效模式与疲劳寿命分析
汤巍, 景博, 黄以锋, 盛增津, 胡家兴
Analysis of Failure Modes and Life of Solder Joints Under Coupling of Vibration and Thermal Loads
TANG Wei, JING Bo, HUANG Yi-feng, SHENG Zeng-jin, HU Jia-xing
电子学报
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2017, (7): 1613
-1619
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DOI: 10.3969/j.issn.0372-2112.2017.07.010
